Vice President

Exsquare Allianze
Nashik, Maharashtra, India

EXSQUARE GLOBAL TECHNOLOGIES PVT LTD (EXSQUARE GROUP) Position Ref: EGT-SC-HW-2026 CORPORATE HUMAN RESOURCES DIVISION

  • POSITION: DIRECTOR / HEAD OF HARDWARE ENGINEERING & PRODUCT MANUFACTURING

Leadership Charter: Prototype Finalization, Industrial Product Design, Multi-Sensor Edge Configuration & Turnkey Manufacturing Scale Job Code / Position Core Product Scope Experience Level Dir-Hardware-SC Autonomous Retail Smart Cart Fleet 10+ to 15+ Years (Executive Band) 1. EXECUTIVE MANDATE & PURPOSE Reporting Line Operating Location Compensation Mode Exsquare Global Technologies is scaling its flagship Autonomous Smart Cart platform—an edge-AI retail terminal featuring synchronized multi-camera vision, high-speed dropscan optical engines, dynamic 4-point scale tare weighing, and retail media touchscreens.

We are recruiting a seasoned Director/Principal Head to lead hardware maturity from prototype sign-off to full turnkey mass production (10,000+ units) at strict BOM economics across Indian manufacturing corridors and global Tier-1 suppliers.

2. KEY RESPONSIBILITIES & END-TO-END OWNERSHIP A. Prototype Finalization & Industrial Product Design (DFM / DFA) B. Multi-Sensor Edge Architecture & Configuration Chief Technology Officer (CTO) / MD Pune / Nashik Industrial Corridor, India Fixed Executive CTC + ESOPs + Production Incentive Sign off on final 3D CAD engineering models, structural simulations, and prototyping iterations. Oversee the modular retrofit handle console (525 mm × 350 mm × 230 mm) engineered with dual-clamp brackets for standard Ø38mm trolley tubing and 220mm nesting clearance. Direct structural drop testing, IP54 weatherproofing, and vibration resistance for the 180L zinc-plated steel trolley and snap-on ABS wrap. Architect and calibrate the complete onboard electronics array: (1) Rockchip RK3588S / NXP i.MX8M Plus SoM (6 TOPS NPU) for on-cart neural inference; (2) Dual onsemi AR0234 Global Shutter MIPI cameras for item trajectory and theft monitoring; (3) Newland FM3080 / Zebra SE4710 2D dropscan engines for sub-50ms barcode reading; (4) Base scale load cells paired with Texas Instruments 24-bit ADCs (ADS1234) communicating over an RS-485 serial bus. C. Display, NFC Tap & Lithium Power System Integration Configure the shopper-facing 10.1" optically bonded IPS capacitive multi-touch panel (500 nits anti-glare) and integrated NXP PN7160 NFC contactless loyalty reader. Engineer the high-capacity 12.8V 20–24Ah LiFePO4 battery subsystem and intelligent BMS circuit to achieve a full 14-hour retail operating duty cycle with safe charging dock integration. D. Production Industrialization, Tooling & Quality Governance Execute one-time platform tooling (NRE ₹44 Lakhs budget) including custom multi-cavity injection molds and thermoforming dies. Establish PPAP, FMEA, automated end-of-line (EOL) functional calibration test rigs, and manage pilot validation (100 units) transitioning to commercial runs (1,000 to 10,000+ units).

RECRUITMENT DOSSIER DOCUMENT REF: EGT-JD-SC2026-V1

CANDIDATE QUALIFICATIONS & COMPETENCY PROFILE

Required Credentials & Leadership Education: B.E. / B.Tech / M.Tech in Mechanical, Electronics & Communication (ECE), Mechatronics, or Embedded Systems. Total Experience: Minimum 10+ to 15+ years of handson industrial experience in electro-mechanical or IoT systems. Production Track Record: Minimum 5+ years directly owning DFM/DFA, contract manufacturing (EMS), tooling sign-offs, and mass assembly ramp. Certification Advantage: PMP, Six Sigma Black Belt, or certified Lead Auditor for ISO 9001/IATF 16949 standards. Core Technical Proficiencies Embedded Systems: Deep mastery of ARM Cortex-A compute SoMs, camera MIPI pipelines, and high-speed bus interfaces (RS-485, I2C, SPI). Industrial Design: Expert in SolidWorks / PTC Creo, mold flow simulation, DFM for plastic injection molding, and metal chassis fabrication. Sensor Fusion: Proven competence calibrating strain gauge load cells, milligram ADC drift correction, and vision-sensor interlocks. Standards & Compliance: Clear ownership of BIS, CE, FCC, RoHS, and PCI-PTS / EMV POS terminal safety certifications. 4. SUPPLY CHAIN SOURCING & COMPONENT ECOSYSTEM OWNERSHIP SUBSYSTEM DOMAIN Compute & Vision Core Optical Scanning Engine Weight & Power Pack Mechanical Body & Tooling TECHNICAL SPECIFICATIONS & SOURCING TARGET Rockchip RK3588S (6 TOPS NPU) + Dual AR0234 MIPI Global Shutter cameras High-speed downward 2D imager, sub-50ms crinkled/metallic barcode decode 4-point planar beam load cells, TI ADS1234 ADC + 12.8V 20Ah LiFePO4 pack 180L zinc-plated steel basket, ABS handle console & 360° thermoformed panels STRATEGIC VENDORS TO MANAGE Toradex India (Bengaluru), e-con Systems (Chennai), onsemi (USA), Rockchip Global Newland AIDC (Noida / Global), Zebra Technologies (USA) Sansui Electronics (Pune), Zemic Europe, Battrixx / Kabira Mobility (Pune) Wanzl India (Talegaon, Pune), Godrej Tooling (Mumbai), Polyplastics India 5. TALENT SOURCING CHANNELS & INTERVIEW EVALUATION FRAMEWORK TARGET INDUSTRY VERTICALS Industrial IoT & Smart Kiosks Autonomous Mobility & Robotics Tier-1 Contract EMS & Scale Tech BENCHMARK TARGET COMPANIES Honeywell, Siemens, Advantech, Verifone, Pine Labs, Toradex Ather Energy, Ola Electric, GreyOrange, Addverb, CynLr Dixon Technologies, Sanmina, Jabil, Mettler Toledo, Essae-Teraoka Direct Hiring Contact: hr@mysmartcart.in contact@mysmartcart.in

KEY ASSESSMENT GATE Round 1: System architecture & sensor synchronization (SoM + Vision + Scale) Round 2: Tooling NRE, DFM execution, mold flow, and drop/vibration resilience Round 3: Sourcing resilience, Tier-1 vendor negotiation & target BOM defense (₹68k)

Executive Hotline: +91 7030664646 Corporate HQ: Nashik, Maharashtra, India

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